Osceola County in Kissimmee, Florida has secured a significant federal contract to establish a specialized manufacturing hub for advanced semiconductor packaging. The project, with funding capped at nearly $289.12 million, is set to advance the development of secure 2.5-D and 3-D system integration technologies, with a projected completion by the end of October 2028. Initial funding from the Army’s 2023 fiscal year budget has already contributed over $3.65 million to kickstart the initiative.
Key Points:
- The contract awarded to Osceola County is aimed at creating a specialized production environment for advanced semiconductor packaging systems.
- This initiative is expected to enhance the domestic capability for producing secure and sophisticated electronic components.
- The funding agreement sets a financial ceiling of approximately $289.12 million, with work slated for completion by October 27, 2028.
- An initial amount of $3.65 million has been allocated from the Army’s 2023 fiscal resources to commence the project.
- The Army Contracting Command in Rock Island Arsenal, Illinois, is managing the contracting process for this development.
